NEPES, GLOBAL TOP-TIER PARTNER
| Date | Disclosure Title | Reporter | 2024-03-28 | 대표이사변경 | 네패스 | 2024-03-28 | 정기주주총회결과 | 네패스 | 2024-03-27 | 사업보고서 (2023.12) | 네패스 | 2024-03-26 | 감사보고서제출 | 네패스 | 2024-03-19 | 기타경영사항(자율공시) (감사보고서 제출 지연) | 네패스 | 2024-03-13 | 주주총회소집공고 | 네패스 | 2024-03-13 | 매출액또는손익구조30%(대규모법인은15%)이상변동 | 네패스 | 2024-03-13 | 주주총회소집결의 | 네패스 | 2024-02-26 | 주식등의대량보유상황보고서(일반) | 이병구 | 2023-12-14 | 주주명부폐쇄기간또는기준일설정 | 네패스 |
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nepes will participate in the Electronic Components and Technology Conference(ECTC) held online from June 1 to July 4, 2021 and introduce advanced packaging technology based on 'End-fab' technology.
ECTC, which marks its 71st anniversary this year, is a worldwide prestigious event in the fields of packaging, electronic components and technology education, and is a place for cooperation and technology exchange in which 106 global semiconductor companies participate.
▲nepes Virtual Conference in ECTC
▲In-Soo Kang, Head of Future Technology Planning Division, introducing nSiP solutions in the 2021 ECTC Technical Program
nepes participated in this event as a conference sponsor and participated in 'nSiP (nepes' System in Package) Platform for Various Module Packaging Applications' (Kang In-soo, Kim Jong-heon, Lee Jun-gyu, Shin Won-sun, Kim Nam-cheol, Park Sang-yong) and 600mm FOPLP as a Scale Up Alternative to 300mm FOWLP With 6-Sided Die Protection' (Jacinta Aman Lim, Park Yoon-mook, Edil De Vera, Kim Byeong-cheol, Brett Dunlap ) will release a presentation video.
Event information: https://www.ectc.net
■Presentation video
'nSiP(System in Package) Platform for Various Module Packaging Applications' : https://youtu.be/-i0k_kHHGJU
'600mm FOPLP as a Scale Up Alternative to 300mm FOWLP With 6-Sided Die Protection' : https://youtu.be/zskiFK--8gQ
■Brochure
nSiP : https://url.kr/1yfwne
nPLP : https://url.kr/6plyox
