- Stable yield achievement of 600mm FOPLP Fab at Cheongan Campus ... Mass production ramp-up

- The world's first large-panel packaging process enabling significant productivity improvement and more accessibility to 'advanced technology'

 

Nepes Laweh announced that it will more than double its capacity next year as it begins mass production of FOPLP, the next-generation packaging process.

 

Nepes Laweh held the completion ceremony of the Cheongan Campus PLP fab on December 7th with the presence of Minister of Trade, Industry and Energy, Governor of Chungcheongbuk-do, and representatives from customers and partners.

The company announced that the FOPLP manufacture line completed customer certification in the third quarter and achieved a stable yield and started full-scale mass production and plans to more than double its capacity next year aligned with strong customer demand.

 

The PLP Fab, where the completion ceremony was held, was the first fab built on the 186,000㎡ Cheongan Campus site which is the size of 25 soccer fields: with a total building area of 34,000㎡. The fab can produce up to 96,000 panels per year based on 600mm PLP.

 

Based on this next-generation packaging line, nepes would receive a favorable evaluation about her ability to provide high-density packaging solutions required for Non-memory semiconductors for each application, such as smartphones, automobiles, and IoT, aligned with customer needs.

"FOPLP is the best packaging solution for high-end semiconductors as a result of long cooperation with global partners such as materials, parts, and equipment," said Chilhee Chung, Chairman of Nepes and GM of Semiconductor Business

 

According to the industry, nepes laweh's FOPLP is a large square panel with a size of 600mm by 600mm, and it is analyzed that productivity has greatly improved compared to the 300mm round FOWLP. In particular, the fan-out technology applied to Nepes Laweh’s FOPLP has been proven to have high stability compared to existing technologies.

 

As demand increases mainly from advanced semiconductor manufacturers in the future, its market share is expected to significantly increase in the overall packaging market.

 

About Nepes Laweh

Nepes Laweh is leading company in the system semiconductor industry with advanced fan-out packaging solution. In the era of the 4th industrial revolution, when semiconductors are refined and advanced, such as 5G, self-driving cars, and smartphones, we are presenting new standards for fan-out packages based on nPLP^™ technology using 600mm large square panels.