Nepes promotes new packaging technology at an international conference

The packaging provider introduces ‘nPLP’, a next-generation packaging solution

The company also presents FOWLP-based antenna-in-package technology on the 3^rd of this month

Nepes presented at the 2022 Electronic Components and Technology Conference (ECTC), which took place in San Diego from May 31 to June 3 (PDT), to showcase its cutting-edge semiconductor packaging technology.

Organized by IEEE Electronics Packaging Society, the conference is an international event attended by experts in the fields of electronic components and materials, packaging, and IoT to share their visions about future technology and discuss methods of cooperation. This year marks the 72^nd iteration of ECTC. The 2022 ECTC brings together 106 corporations from 24 countries, including Nepes, Samsung Electronics, TSMC, and Amkor Technology.

This year, Nepes became the world’s first company to successfully mass-produce its nPLP solution. An improvement over the previous 300-mm round FOWLP, nPLP is a next-generation packaging solution in which a fan-out package is implemented onto a 600-by-600-mm large-size square panel.

Lewis Kang, the Managing Director of the Future Technology Planning Division gave a talk titled “FOWLP-based antenna in package (FO-AiP) using 5G mmWave) on June 3, the last day of the event. Kang introduced the antenna-in-package technology, which can reduce signal loss in 5G smartphone communication antennae using Nepes’ noteworthy fan-out technology.

“We promoted Nepes’ unique PLP and AiP technology for 5G use at the international ECTC conference, which is attended by semiconductor experts from all over the world alongside possible clients,” said Kang. “We paved the way for future discussions regarding new business developments with possible global, top-tier clientele attending the conference.”