The "Electronics Device Industry News" of Japan published a visit report on Nepes on October 19, 2023. The highlight of the report, which featured an interview with Nepes CEO, Byung-Koo Lee, was the industry's first commercialized MDxTM(Molded Direct) technology in collaboration with Deca Technologies.  This tech bypasses the use of Polyimide(PI), an essential material for the FO(Fan-out) technique, and only employs the Molding method to achieve FO-PLP. This simplification of the process is anticipated to serve as an alternative to the QFN(Quad Flat No-lead) process. Nepes plans to undergo testing until the end of 2023 and kick off mass production in 2024. They are especially looking to broaden the application of this technology in semiconductors for automobiles and expand their business into the Japanese market.

In 2021, Nepes was recognized as one of the global TOP 10 advanced packaging companies in a semiconductor supply chain report released by the White House in the USA. They play a pivotal role in the advanced packaging sector. CEO Lee Byung-goo stated, "By building partnerships with major global semiconductor companies and continuously developing technologies that cannot be addressed with our current processes, our goal is to become a top-tier advanced packaging company globally within the next five years."