NEPES, GLOBAL TOP-TIER PARTNER
| Date | Disclosure Title | Reporter | 2025-04-01 | 신규시설투자등 | 네패스 | 2025-03-28 | 사외이사의선임ㆍ해임또는중도퇴임에관한신고 | 네패스 | 2025-03-28 | 정기주주총회결과 | 네패스 | 2025-03-20 | 사업보고서 (2024.12) | 네패스 | 2025-03-20 | 감사보고서제출 | 네패스 | 2025-03-13 | 주주총회집중일개최사유신고 | 네패스 | 2025-03-13 | 주주총회소집공고 | 네패스 | 2025-03-13 | 주주총회소집결의 | 네패스 | 2025-03-13 | 매출액또는손익구조30%(대규모법인은15%)이상변동 | 네패스 | 2025-02-25 | [기재정정]타법인주식및출자증권취득결정 | 네패스 |
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Nepes participate in the UCIe(Universal Chiplet Interconnect Express) consortium launched to establish an industry standard for ‘Next-generation chip packaging technology’.
Semiconductor companies such as ▲AMD ▲Arm ▲Qualcomm ▲ASE, including TSMC and Intel, and IT companies such as ▲Google Cloud ▲Meta ▲Microsoft also participated in the consortium.
The consortium aims to establish UCIe as a new connectivity standard such as PCIe, USB, NVMe, etc.
Members will soon begin working on the creation of the next-generation UCIe technology standard, including the chiplet form factor, management, enhanced security and other essential protocol definitions after the UCIe 1.0 specification is drafted.
If the UCIe standard is established, it is compatible with other companies' chiplet structures. This can lead to cost savings and faster time to market.
