NEPES, GLOBAL TOP-TIER PARTNER
| Date | Disclosure Title | Reporter | 2025-11-14 | 분기보고서 (2025.09) | 네패스 | 2025-09-30 | 주식등의대량보유상황보고서(일반) | 이창우 | 2025-08-14 | 반기보고서 (2025.06) | 네패스 | 2025-07-04 | [기재정정]신규시설투자등 | 네패스 | 2025-06-16 | 주식등의대량보유상황보고서(일반) | 이창우 | 2025-06-16 | 임원ㆍ주요주주특정증권등소유상황보고서 | 이창우 | 2025-06-16 | 주식등의대량보유상황보고서(일반) | 이병구 | 2025-06-16 | 임원ㆍ주요주주특정증권등소유상황보고서 | 이병구 | 2025-06-16 | 최대주주변경 | 네패스 | 2025-05-16 | 주식등의대량보유상황보고서(일반) | 이병구 |
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Nepes participate in the UCIe(Universal Chiplet Interconnect Express) consortium launched to establish an industry standard for ‘Next-generation chip packaging technology’.
Semiconductor companies such as ▲AMD ▲Arm ▲Qualcomm ▲ASE, including TSMC and Intel, and IT companies such as ▲Google Cloud ▲Meta ▲Microsoft also participated in the consortium.
The consortium aims to establish UCIe as a new connectivity standard such as PCIe, USB, NVMe, etc.
Members will soon begin working on the creation of the next-generation UCIe technology standard, including the chiplet form factor, management, enhanced security and other essential protocol definitions after the UCIe 1.0 specification is drafted.
If the UCIe standard is established, it is compatible with other companies' chiplet structures. This can lead to cost savings and faster time to market.
