Nepes promotes new packaging technology at an international conference
The packaging provider introduces ‘nPLP’, a next-generation packaging solution
The company also presents FOWLP-based antenna-in-package technology on the 3rd
of this month
Nepes presented at the 2022 Electronic
Components and Technology Conference (ECTC), which took place in
San Diego from May 31 to June 3 (PDT), to showcase its cutting-edge
semiconductor packaging technology.
Organized by IEEE
Electronics Packaging Society, the conference is an international event
attended by experts in the fields of electronic components and materials,
packaging, and IoT to share their visions about future technology and discuss
methods of cooperation. This year marks the 72nd iteration of ECTC.
The 2022 ECTC brings together 106 corporations from 24 countries, including
Nepes, Samsung Electronics, TSMC, and Amkor Technology.
This year, Nepes became the
world’s first company to successfully mass-produce its nPLP solution. An improvement over the previous 300-mm round FOWLP, nPLP is a next-generation packaging
solution in which a fan-out package is implemented onto a 600-by-600-mm
large-size square panel.
Lewis
Kang, the Managing Director of the Future Technology Planning Division gave a
talk titled “FOWLP-based antenna in package (FO-AiP) using 5G mmWave) on June
3, the last day of the event. Kang introduced the antenna-in-package
technology, which can reduce signal loss in 5G smartphone communication
antennae using Nepes’ noteworthy fan-out technology.
“We
promoted Nepes’ unique PLP and AiP technology for 5G use at the international
ECTC conference, which is attended by semiconductor experts from all over the
world alongside possible clients,” said Kang. “We paved the way for future
discussions regarding new business developments with possible global, top-tier
clientele attending the conference.”