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NEWS
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Nepes wins the ESG Management CEO Grand Prize
Nepes won the ESG Management CEO Grand Prize (Corporate Governance Sector) at the ‘2021 ESG Management Awards Ceremony and Best Case Presentation’ held at the National Assembly Hall conference room on December 15th.This event was co-hosted by the Office of National Assembly member Joo-Young Kim and the Audit and Sharing Research Institute, and was prepared to further vitalize and encourage ESG management, which is indispensable in corporate activities.The organizer selected the ESG management target awardees based on the company's sustainability report, and included 9 environmental indicators such as general energy consumption, renewable energy consumption, and greenhouse gas emissions, and 12 other environmental indicators including employee safety, win-win growth support for business partners, and support for local communities. Each of the nine governance indicators, such as social indicators, management performance evaluation and compensation, identification of stakeholder ESG needs, and participation in global partnerships, was scored and evaluated. Nepes Chairman Lee Byung-koo was selected as the best CEO in the corporate governance sector and received this award.
2021-12-22 -
Nepes Laweh set new industry benchmark with 600mm large panel M-Series fan-out volume production
Nepes Laweh corporation announced the successful production qualification and ramp-up of the world’s first 600mm x 600mm large panel manufacturing line using Deca’s M-Series™ fan-out technologies. Nepes Laweh held the completion ceremony of the Cheongan Campus PLP Line on December 7th with the presence of Minister of Trade, Industry and Energy, Governor of Chungcheongbuk-do, and representatives of customers and partners. The company announced that the FOPLP line completed customer certification in the third quarter and secured a stable yield and entered full-scale mass production. The PLP fab, which held the completion ceremony this time, was the first fab built on the 186,000㎡ Cheongan Campus site with 25 soccer fields, and was a total building area of 34,000㎡. This is a level that can produce up to 96,000 panels per year based on 600mm PLP. Based on this next-generation manufacturing line, Nepes is evaluated to be able to provide high-density packaging solutions required for advanced system semiconductors for each application, such as smartphones, automobiles, and IoT, according to customer needs. "FOPLP is the best packaging solution for high-end semiconductors as a result of long cooperation with global partners such as materials, parts, and equipment," said Chilhee Chung, Chairman of Nepes and GM of Semiconductor Business “We’re pleased to be working with nepes to bring the industry’s largest format 600mm square panel to volume production” commented Tim Olson, CEO of Deca. “With initial production focused on single and multi-die packages for leading Smartphone producers, the future is heterogenous integration of chiplets using Deca’s Gen 2 technology. A recent customer application with 10 embedded chiplets was designed into a 36mm x 36mm package. Such a large device is limited to 73% maximum utilization on 300mm round format due to edge losses. On 600mm, the utilization jumps to 92% delivering greater than 25% cost reduction on area utilization alone.” About Nepes Laweh www.nepes.co.kr Nepes Laweh is leading company in the system semiconductor industry with advanced fan-out packaging solution. In the era of the 4th industrial revolution, when semiconductors are refined and advanced, such as 5G, self-driving cars, and smartphones, we are presenting new standards for fan-out packages based on nPLP™ technology using 600mm large square panels. About Deca Technologies www.ThinkDeca.com Deca is a leading provider of advanced packaging technology to the semiconductor industry with M-Series™ fan-out and Adaptive Patterning® real-time design-during-manufacturing. A growing list of industry leaders have completed technology transfer and license agreements for access to Deca’s proven structures, processes, materials, equipment, design systems and know-how. Starting with the highest quality and reliability in Gen 1 aimed at Smartphone applications to the growth of Gen 2 for chiplets and heterogeneous integration, Deca’s technologies are emerging as key industry standards for the future.
2021-12-09 -
Nepes Laweh started Volume Production of ‘FOPLP’, a next-generation packaging solution
- Stable yield achievement of 600mm FOPLP Fab at Cheongan Campus ... Mass production ramp-up - The world's first large-panel packaging process enabling significant productivity improvement and more accessibility to 'advanced technology' Nepes Laweh announced that it will more than double its capacity next year as it begins mass production of FOPLP, the next-generation packaging process. Nepes Laweh held the completion ceremony of the Cheongan Campus PLP fab on December 7th with the presence of Minister of Trade, Industry and Energy, Governor of Chungcheongbuk-do, and representatives from customers and partners. The company announced that the FOPLP manufacture line completed customer certification in the third quarter and achieved a stable yield and started full-scale mass production and plans to more than double its capacity next year aligned with strong customer demand. The PLP Fab, where the completion ceremony was held, was the first fab built on the 186,000㎡ Cheongan Campus site which is the size of 25 soccer fields: with a total building area of 34,000㎡. The fab can produce up to 96,000 panels per year based on 600mm PLP. Based on this next-generation packaging line, nepes would receive a favorable evaluation about her ability to provide high-density packaging solutions required for Non-memory semiconductors for each application, such as smartphones, automobiles, and IoT, aligned with customer needs. "FOPLP is the best packaging solution for high-end semiconductors as a result of long cooperation with global partners such as materials, parts, and equipment," said Chilhee Chung, Chairman of Nepes and GM of Semiconductor Business According to the industry, nepes laweh's FOPLP is a large square panel with a size of 600mm by 600mm, and it is analyzed that productivity has greatly improved compared to the 300mm round FOWLP. In particular, the fan-out technology applied to Nepes Laweh’s FOPLP has been proven to have high stability compared to existing technologies. As demand increases mainly from advanced semiconductor manufacturers in the future, its market share is expected to significantly increase in the overall packaging market. About Nepes Laweh Nepes Laweh is leading company in the system semiconductor industry with advanced fan-out packaging solution. In the era of the 4th industrial revolution, when semiconductors are refined and advanced, such as 5G, self-driving cars, and smartphones, we are presenting new standards for fan-out packages based on nPLP™ technology using 600mm large square panels.
2021-12-07 -
[ESG Report] Nepes that 70% of employees donate and 80% of waste is recycled
Nepes, a semiconductor back-end service(OSAT) company, is strengthening ESG(environmental, social, and governance) management centering on the management philosophy of Chairman Lee Byung-koo. All employees are participating in social contribution activities under one of the corporate management philosophies, ‘Volunteer life’. In addition to the existing semiconductor back-end service business, Nepes is advancing into eco-friendly businesses such as secondary battery parts business, while steadily increasing the recycling rate of waste and paying special attention to reducing environmental pollutants.◇ 80% of employees are local talents… Social contribution activities continue every yearChairman Lee Byung-koo, who founded Nepes in 1990, believed that coexistence with society is essential for a company to grow continuously. Chairman Lee's management philosophy is that just as the water in a pond rots when it accumulates, the company's internal funds must also be channeled toward society. In particular, he emphasizes the voluntary social contribution activities of his employees, saying, "It is more important for many employees to participate than to make a large donation amount." Lee Byung-koo, Chairman of Nepes. /Nepes provided‘n Nanum Seed’, a social contribution activity of Nepes, contains Chairman Lee’s management philosophy. n Nanum Seed, launched in 2009, is an in-house donation system based on a one-to-one matching grant, in which the company also adds the same amount to the amount donated by employees. As executives such as Chairman Lee joined, the participation rate of general employees is also high. According to Nepes, 920 employees signed up as of December last year, and the subscription rate is over 70%. The amount of donations has also steadily increased year by year, and the donation amounted from 16.88 million won in 2016 to 246.78 million won last year, more than doubled in five years.Nepes delivers the funds collected through n Nanum Seeds to local groups and individuals every month. In addition to treatment and surgery expenses for economically difficult patients, it provides subsidies for the elderly and disabled households living alone. In addition, through the volunteer club organized by employees voluntarily, mentoring exchanges with students who grow up in difficult environments, briquette delivery, and kimchi delivery activities are continued every year. An official from Nepes said, "In the second half of this year, to celebrate the 31st anniversary of the foundation, we plan to donate the thank-you piggy bank collected by our employees to 31 individuals, institutions and organizations."Nepes is also contributing to the local community by creating jobs. The number of employees increased from 758 in 2018 to 1,269 this year under Chairman Lee's management philosophy that the existence value of the company is 'job creation'. In particular, it is evaluated that it has contributed greatly to creating local jobs by hiring more than 80% of all employees as local talents. After receiving the Presidential Citation in the ‘local job creation’ sector in 2017, Nepes was also selected as an excellent employment company by Chungbuk Province this year. The long-term goal is to increase the number of employees to 10,000.Nepes employees in volunteer work. /Nepes provided◇ Waste recycling rate increased from 40 to 80% in 5 yearsNepes also takes the lead in preserving the local environment through waste treatment and recycling. In general, since the semiconductor industry uses a vast amount of purified water in the manufacturing process, a large amount of waste is inevitably generated. Nepes has established an advanced waste treatment system to recycle a significant portion of waste generated in the process. In 2018, the recycling rate of waste in Nepes was only 40%, but thanks to steady technological development, it increased to 80% last year. Only 800 tons (t) of waste are recycled annually.Nepes plans to increase the recycling rate to 100% by spurring waste treatment research and development. In July, it was also selected for the government's clean factory development project and decided to conduct wastewater recycling research and development by 2023 together with the Korea Testing Laboratory (KTL). It took on the role of securing the raw water quality database (DB) by applying the wastewater treatment plant of Abspiel, an industrial filter manufacturer, to the manufacturing process.The ns3 campus of Nepes located in Cheongan, North Chungcheong Province. /Nepes providedAs the electric vehicle (EV) market is growing rapidly following the recent energy storage system (ESS), Nepes plans to increase its investment in ‘lead tab’, a key component of secondary batteries. The lead tab film is a kind of 'passage (terminal)' through which the secondary battery sends electricity to the outside, and is one of the essential parts for secondary batteries. An official from Nepes said, “According to the global energy conversion trend, the secondary battery industry is inevitably ahead of growth.Nepes also showed a strong will for the eco-friendly business by increasing the proportion of the lead tap business. It plans to break up with the existing display touch screen panel business centering on its subsidiary, Nepes Yahard, and focus on the production of lead tab film. Last year, the annual sales of Nepes' rechargeable battery business recorded 11.9 billion won, up 55% from the previous year. The lead tab film produced by Nepes Yahard is supplied to large companiesSource: https://biz.chosun.com/industry/company/2021/09/05/Y5GUXNMS3JCUPBD4TBP2TPEVJ4/
2021-09-05 -
nepes announces 'nSiP', advanced packaging technology without using the PCBs
-nepes announced substrate-less SiP(System in Package) in the Electronic Components and Technology Conference(ECTC)-The industry is giving attention to nepes SiP as an alternative solution for the PCB replacement… Reliability test completed Recently, due to an unprecedented PCB shortage used for semiconductor packaging, the market is interested in SiP solutions based on FOWLP and FOPLP technologies. Nepes, the advanced back-end foundry, promoted substrate-less SiP technology through ECTC and started to target the market. 'nSiP (nepes System in Package)', unveiled by Nepes, is a leading-edge technology of the system semiconductor packaging roadmap. nSiP is based on ‘End-fab’ technology without substrate and wire bonding and is the most optimized packaging solution for high performance, high density, and small form factor. Also, nSiP is deployed with redistribution layers on a chip instead of PCBs. It allows to reduce the overall size of IC by 30 percent, the thickness by around 60 percent, and the development period by more than 50 percent. The company recently released sample products of packaging to customers across the globe. While semiconductor manufacturers are having difficulties in launching and developing products due to a shortage of substrate and PCB supply, nepes is about to mass-produce FOPLP based on the End-fab technology. “The PLP and nSiP could meet growing demand for high-performing chips and components by providing a new solution for the need” said Kim Tae-hoon, President Corporate Marketing at Nepes. “It will also help relieve the chronic shortage of substrate in semiconductor industry,” he said.
2021-06-09 -
nepes participates in Electronic Components and Technology Conference(ECTC) 2021
nepes will participate in the Electronic Components and Technology Conference(ECTC) held online from June 1 to July 4, 2021 and introduce advanced packaging technology based on 'End-fab' technology.ECTC, which marks its 71st anniversary this year, is a worldwide prestigious event in the fields of packaging, electronic components and technology education, and is a place for cooperation and technology exchange in which 106 global semiconductor companies participate.▲nepes Virtual Conference in ECTC▲In-Soo Kang, Head of Future Technology Planning Division, introducing nSiP solutions in the 2021 ECTC Technical Programnepes participated in this event as a conference sponsor and participated in 'nSiP (nepes' System in Package) Platform for Various Module Packaging Applications' (Kang In-soo, Kim Jong-heon, Lee Jun-gyu, Shin Won-sun, Kim Nam-cheol, Park Sang-yong) and 600mm FOPLP as a Scale Up Alternative to 300mm FOWLP With 6-Sided Die Protection' (Jacinta Aman Lim, Park Yoon-mook, Edil De Vera, Kim Byeong-cheol, Brett Dunlap ) will release a presentation video.Event information: https://www.ectc.net■Presentation video 'nSiP(System in Package) Platform for Various Module Packaging Applications' : https://youtu.be/-i0k_kHHGJU'600mm FOPLP as a Scale Up Alternative to 300mm FOWLP With 6-Sided Die Protection' : https://youtu.be/zskiFK--8gQ■BrochurenSiP : https://url.kr/1yfwnenPLP : https://url.kr/6plyox
2021-06-03 -
「基板なし」が主流に("No board" is the mainstream - Japan, The Daily NNA
「基板なし」が主流に 一方で、基板不足の影響を受けていないパッケ?ジ? 門メ?カ?もある。 韓?のネぺスは、基板を使わずにウエハ??態のまま で最終工程まで?理できる技術を持つ。ネペスは今年1 月、この「ウエハ?レベルパッケ?ジ」技術を生かし て、CPUやメモリ?など複?のチップを?一のパッケ ?ジに形成してシステム化を?現する「システム?イ ン?パッケ?ジ」技術を公開した。基板とワイヤを用い る??方法に比べ、??面積を3分の1以下に縮小でき るメリットがあるという。 システム?イン?パッケ?ジ技術は、複?個の集積回 路(IC)またはパッケ?ジを積層することで、メモリ ?の大容量化や機能の複合化を?現する??技術。現在 は、スマホの主要部品の 73%がシステム?イン?パッケ ?ジで構成されているが、そのうちの9割は基板やワイ ヤを使った??方式のため、同技術の伸びしろは大き い。 (the rest omitted)"No board" is the mainstream.There is a package maker where have not been affected by the shortage of substrates.Nepes in Korea has the technology to process from wafer to packaging without using a substrate.In January of this year, Nepes unveiled the "System in Package" technology by using "Wafer Level Package" technology."System in Package" technology forms a single package of multiple chips such as CPU and memory and realizes systematization.It has the advantage of reducing the mounting area by less than one-third compared to the conventional method using a substrate and wire.(the rest omitted)[Source = Japan, The Daily NNA https://bit.ly/3eF8QzM]
2021-04-27 -
Employee-centered management drives success-The Korea Times
By Kim Bo-eunNepes, a leading firm in packaging and test services for semiconductors, have racked up a series a firsts in the parts and materials industry.It became the first local company to commercialize fan-out wafer level packaging and also became the world's first company to commercialize panel-level packaging. In addition, it is the first in the industry to mass produce neuromorphic chips used to model the human brain.(the rest omitted)[Source = The Korea Times http://www.koreatimes.co.kr/www/tech/2021/03/129_305102.html]
2021-03-08 -
High-tech parts suppliers to watch in 2021-The Korea Times
Eyes are on local SMEs manufacturing high-tech materials, components and equipment amid expectations of a super cycle for semiconductors this year and scaled-up government support.The semiconductor equipment market is expected to grow to $71.9 billion in 2021, up 4.3 percent from $68.9 billion in 2020. The market is forecast to grow to 76.1 billion in 2022.(omitted)NepesAlso among promising players is Nepes, a leading outsourced semiconductor assembly and test (OSAT) firm.OSATs offer third-party packaging and test services for semiconductor firms. They package silicon devices that are made by foundries and test devices prior to shipping them to the market. Their role comes in the end stage of semiconductor manufacturing process after the wafer fabrication and wafer probe stages.(the rest omitted)[Source=The Korea Times https://www.koreatimes.co.kr/www/tech/2021/01/129_302020.html]
2021-01-06 -
Nepes strengthens Fan-Out Packaging portfolio by licensing Deca’s advanced M- Series™ technology
Upgrade business competitiveness to the next level with high reliability fan-out packaging technology Nepes(KOSDAQ: 033640), one of the top tier advanced packaging service providers, licenses advanced packaging technology from Deca Technologies and take over semiconductor packaging line. Nepes announced on 1st Oct., they have decided to license the advanced packaging technology M-Series and take over the semiconductor advanced packaging fab from Deca Technologies. Nepes will acquire Deca's wafer level chip scale production line including Fan-out wafer-level packaging(FOWLP) in support of active customers as well as enter into a technology license agreement. FOWLP is an innovative back-end technology in semiconductor manufacturing as the evolution of wafer fab technology is currently slowing down. The FOWLP is applied to advanced semiconductors enabling high integration and superior thermal dissipation characteristics and is a fast growing market with revenues expected at around $3B in 2025. FOWLP market has a high entry barrier. There are only 4 OSAT(Outsourced Semiconductor Assembly and Test) companies with FOWLP mass production ability globally including Nepes. Nepes with plans to gain 10% of the market share within 5 years of this acquisition. Nepes is currently strengthening its portfolio to gain leadership in logic chip packaging market. In particular, Deca's FOWLP technology(M-Series™) provides high reliability, ideal for mobile chipsets with enhanced chip protection and stability. Nepes said, "This technology including M-Series™ and Adaptive Patterning™ will create strong synergy with Nepes own Panel Level Packaging(PLP) and FOWLP technology growing our leadership in advanced packaging by actively expanding Korea's ecosystem development strategy for the logic chip industry." ----------------------About NepesFounded in 1990, Nepes is a packaging solution provider in system IC. Started with chemical business, acquired US patent for solder bumping technology for semiconductors in 2004. Nepes commercialized for the first time in Korea, Plating bumping, WLP(Wafer level packaging), FOWLP(Fan-out Wafer level packaging) and PLP(Panel level packaging) technology. Providing FOWLP service to global No.1 Automotive chip maker since 2015 and enhancing PLP service leadership in global OSAT market.
2019-10-01 -
Big Potential for Fan-Out Packaging
SEOUL, Korea July 12, 2015 As a leading Korean semiconductor wafer level packaging solutions provider, nepes has been shipping automotive components packaged by FOWLP in HVM (High Volume Manufacturing) mode in accordance with German automotive makers'qualifications. nepes is gearing up for mobile RF products with an ultra-thin profile range of 200~300 μm. nepes has a proprietary feature of an embedded Cu plane inside their FOWLP as an option enabling thin profiles of less than 300 μm and possibly serving as the critical element enhancing electrical and thermal performance.nepes has been focusing on Fan-Out Wafer Level Packages (FOWLP) since 2009, offering advanced packaging solutions based on wafer level platforms, rather than conventional packaging. A big potential of Fan-Out Packaging has recently been recognized by the industry. "nepes is driving ourselves to provide value-added solutions to customers through Fan-Out WLP (Wafer Level Package) in terms of high performance, small form factor, and more importantly, integration. nepes will not overlook the cost effectiveness as Fan-Out WLP will have to compete with plastic packages like QFN, FCBGA, WLP and wire bond, and bumped types of System in Packaging (SiP)," according to nepes.nepes also successfully introduced its Via-Frame Fan-Out PKG (FOP) on a 300mm panel platform, which enables the chip to be face-up for biometric sensor applications and multipackage stack solutions.Furthermore, with capability of multiple redistribution metal layers up to 4, multiple dies embedded with dozens of passive components are integrated into a single FOWLP. This offers the simplicity of the system board design for system makers. It also allows fast development and time to market to customers where not only mobile, but also IoT, smart and electric car, and medical applications are perfectly matched. It is being commercialized now and the production information will be available soon.
2015-07-12